OAI Model 800E 型掩模對準系統(tǒng)
。各種光譜范圍選項:Hg燈:G(436nm),H(405nm)， I(365nm)和310nm線，Hg-Xe燈:260nm和220nm
。基片尺寸范圍從4“8”直徑
。燈功率范圍從200到2000W或LED
。電腦操作和配方存儲
。易于使用的GUI和多功能操縱桿
。手動對齊在頂部和底部雙2 mp GigE攝像機和機動的X-Y-Z-Theta舞臺與操縱桿/菜譜操作
。升***到自動對齊w / Cognex軟件升***
。楔自動補償和機動z軸帶有編碼器和3點水準升***選項
。紅外光學背面對齊選擇升***
。接近(20um): 3.0um，軟觸點:2.0um，硬觸點:1um，真空觸點:≤0.5um
。提供正面和背面接觸和對齊0.5 - 1的準確性
。提供半自動化/研發(fā)和低容量生產(chǎn)模式
。適用于MEMS、半導體、Microfludic納米印記,PSS襯底和CLiPP流程
Model 800E Mask Aligner System
。 Various Spectra Range Options: Hg Lamp: G (436nm), H (405nm), I(365nm) ａnd 310nm lines, Hg-Xe Lamp: 260nm and 220nm
。 Substrate sizes range from 4” to 8” diameter or square
。 Lamp Power range from 200 to 2,000W or LED
。 PC Operation ａnd Recipe Storage
。 Easy to use GUI ａnd Multifunction Joystick
。 Manual Alignment with Top ａnd Bottom Dual 2MP GigE Cameras ａnd Motorized X-Y-Z-Theta Stage with Joystick / Recipe Operation
。 Upgrade to Auto Alignment w/ Cognex Software Upgrade
。 Automated wedge compensation ａnd motorized z-axis with encoder ａnd option for 3 Point Leveling Upgrade
。 IR Optics Backside Alignment Option upgrade
。 Proximity (20um): <3.0um, Soft Contact: <2.0um, Hard contact: 1um ａnd vacuum contact : ≤ 0.5um
。 Provides Front ａnd backside exposure ａnd alignment accuracy of 0.5-1um
。 Available in semi automated / R&D ａnd low volume production modes
。 Applicable for MEMS, Semiconductor, Microfludic, NanoImprinting, PSS Substrate ａnd CLiPP Processes
滬公網(wǎng)安備31011502016460號
