TF500/TF600 適合研發和試生產的全功能系統
HHV TF500及TF600系統設計具有高***工藝能力。系統配置可選擇多種腔室尺寸和工藝附件，以精確的符合用戶需求。這兩個型號的系統都可以安裝多個鍍膜源，也都支持離子束處理選項。有***系列預進樣室（Load Lock）和樣品操縱裝置可供選擇，以提高真空鍍膜效率。
系統配置不銹鋼真空腔室，高真空泵安裝在腔室后方。工藝附件布局采用特殊設計，向每個客戶提供滿意適配化的方案。工藝附件包括熱阻及電子束蒸發源、直流及射頻濺射源、用于工件刻蝕或輔助沉積的離子源。系統可以同時配置熱阻、電子束及磁控濺射源。濺射系統可以配置成向上或向下濺射的結構。工件臺選項包括加熱、冷卻、偏壓和預進樣操作等。
系統控制選項包括穩定的PLC真空控制系統配合手動操作的工藝附件的簡單模式，或者計算機集成控制的自動模式。
The system design of V TF500 ａnd TF600 has advanced process capability.System configuration can choose a variety of chamber size ａnd process accessories, to accurately meet user needs.Both models can install multiple coating sources ａnd both support ion beam treatment options.A range of Load locks ａnd sample manipulators are available to improve vacuum coating efficiency.
The system is equipped with stainless steel vacuum chamber with high vacuum pump installed at the rear of the chamber.The layout of process accessories adopts special design to provide each customer with satisfactory adaptive scheme.Process accessories include thermal resistance ａnd electron beam evaporation sources, dc ａnd rf sputtering sources, ａnd ion sources for workpiece etching or assisted deposition.The system can be configured with thermal resistance, electron beam ａnd magnetron sputtering source simultaneously.Sputtering systems can be configured to sputter up or down.Worktable options include heating, cooling, biasing, ａnd pre-injection operations.
System control options include a stable PLC vacuum control system with a simple mode of manually operated process accessories, or an automatic mode of computer integrated control.
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